2001 Jan 29
7
NXP Semiconductors
Product specification
Silicon PIN diode
BAP64-04W
DATA SHEET STATUS
Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
DOCUMENT
STATUS(1)
PRODUCT
STATUS(2)
DEFINITION
Objective data sheet Development This document contains data from the objective specification for product
development.
Preliminary data sheet Qualification This document contains data from the preliminary specification.
Product data sheet Production This document contains the product specification.
DEFINITIONS
Product specification
?
The information and data
provided in a Product data sheet shall define the
specification of the product as agreed between NXP
Semiconductors and its customer, unless NXP
Semiconductors and customer have explicitly agreed
otherwise in writing. In no event however, shall an
agreement be valid in which the NXP Semiconductors
product is deemed to offer functions and qualities beyond
those described in the Product data sheet.
DISCLAIMERS
Limited warranty and liability
?
Information in this
document is believed to be accurate and reliable.
However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to
the accuracy or completeness of such information and
shall have no liability for the consequences of use of such
information.
In no event shall NXP Semiconductors be liable for any
indirect, incidental, punitive, special or consequential
damages (including - without limitation - lost profits, lost
savings, business interruption, costs related to the
removal or replacement of any products or rework
charges) whether or not such damages are based on tort
(including negligence), warranty, breach of contract or any
other legal theory.
Notwithstanding any damages that customer might incur
for any reason whatsoever, NXP Semiconductors’
aggregate and cumulative liability towards customer for
the products described herein shall be limited in
accordance with the Terms and conditions of commercial
sale
of NXP Semi
conductors.
Right to make changes
?
NXP Semiconductors
reserves the right
to make changes to information
published in this document, including without limitation
specifications and product descriptions, at any time and
without notice. This document supersedes and replaces all
information supplied prior to the publication hereof.
Suitability for use
?
NXP Semiconductors products are
not designed, authorized or warranted to be suitable for
use in life support, life-critical
or safety-critical systems or
equipment, nor in applications where failure or malfunction
of an NXP Semiconductors product can reasonably be
expected to result in personal injury, death or severe
property or environmental damage. NXP Semiconductors
accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at
the customer’s own risk.
Applications
?
Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of
their applications and products using NXP
Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or
customer product design. It is customer’s sole
responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the
customer’s applications and products planned, as well as
for the planned application and use of customer’s third
party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks
associated with their applications and products.
相关PDF资料
BAP65-02,115 DIODE PIN 30V 100MA SOD-523
BAR43C DIODE SCHOTTKY 30V 200MA SOT23
BAR43S DIODE SCHOTTK 30V 200MA SOT23
BAS116UDJ-7 DIODE ARRAY 85V 215MA SOT963
BAS116V-7 DIODE LL 150MW 85V SOT-563
BAS16DXV6T1G DIODE SWITCH DUAL 75V SOT563
BAS16V-7 DIODE SWITCH 75V 150MW SOT-563
BAS16VV-7 DIODE ARRAY 100V 200MA SOT563
相关代理商/技术参数
BAP64-04W-TP 功能描述:RF Diode PIN - Single 175V 100mA 200mW SOT-323 制造商:micro commercial co 系列:- 包装:带卷(TR) 零件状态:有效 二极管类型:PIN - 单 电压 - 峰值反向(最大值):175V 电流 - 最大值:100mA 不同?Vr,F 时的电容:0.5pF @ 1V,1MHz 不同?If,F 时的电阻:1.35 欧姆 @ 100mA,100MHz 功率耗散(最大值):200mW 封装/外壳:SC-70,SOT-323 供应商器件封装:SOT-323 标准包装:3,000
BAP64-05 制造商:NXP Semiconductors 功能描述:PIN Diode Attenuator/Switch 175V TO236AB
BAP64-05,215 功能描述:PIN 二极管 PIN 175V 100MA RoHS:否 制造商:Skyworks Solutions, Inc. 配置: 反向电压:200 V 正向连续电流: 频率范围:10 MHz to 6 GHz 端接类型:SMD/SMT 封装 / 箱体:QFN-3 封装:Reel
BAP64-05215 制造商:NXP Semiconductors 功能描述:DIODE PIN 175V 0.1A SOT-23
BAP64-05-TP 功能描述:PIN 二极管 250mW 100mA, 1.1V RoHS:否 制造商:Skyworks Solutions, Inc. 配置: 反向电压:200 V 正向连续电流: 频率范围:10 MHz to 6 GHz 端接类型:SMD/SMT 封装 / 箱体:QFN-3 封装:Reel
BAP64-05W 制造商:NXP Semiconductors 功能描述:PIN Diode Attenuator/Switch 100V SC70
BAP64-05W T/R 功能描述:PIN 二极管 TAPE-7 DIO-RFSS RoHS:否 制造商:Skyworks Solutions, Inc. 配置: 反向电压:200 V 正向连续电流: 频率范围:10 MHz to 6 GHz 端接类型:SMD/SMT 封装 / 箱体:QFN-3 封装:Reel
BAP64-05W,115 功能描述:PIN 二极管 TAPE-7 DIO-RFSS RoHS:否 制造商:Skyworks Solutions, Inc. 配置: 反向电压:200 V 正向连续电流: 频率范围:10 MHz to 6 GHz 端接类型:SMD/SMT 封装 / 箱体:QFN-3 封装:Reel